Electronics Forum | Thu Mar 01 16:58:05 EST 2001 | davef
Last time we looked at this, JEDEC carefully designated the dimensions of the carriers, but "neglected" to define the component orientation with the carrier. Go to http://www.jedec.org/download/, search for JEP95 JEDEC REGISTERED AND STANDARD OUTL
Electronics Forum | Wed Oct 20 09:27:31 EDT 1999 | Bill Strachan
I suggest that you get a copy of IPC -SM-782A 'Surface Mount Design and Land Pattern Standard'. This gives component dimensions and recommended land patterns for nearl all surface mount components. You could also benmefit from a copy of TopLine Dummy
Electronics Forum | Sun Nov 15 01:21:11 EST 1998 | George Henning
We are considering implementing a change of our operating software to Visual Manufacturing by Lilly Software Associates. We may also add portions of the quality package by IQS to help us meet quality standards (ISO 9002) requirements. If anyone has e
Electronics Forum | Thu Jul 19 14:30:46 EDT 2007 | barryg
Hi Pete, we use and have been using Brady Lasertab markers, they hold up through oven and wash, we use a standard laser printer (I believe we use a special toner though) and a software package called labels unlimited (can find on ebay or amazon) whic
Electronics Forum | Mon Sep 18 20:54:22 EDT 2000 | Dave F
Periodically, our operators insert PTH LEDs on boards incorrectly, because of an apparent lack of standardization in the way various manufacturers package LEDs. For instance, for alternate parts some manufacturers make: * Cathode leads long, some ma
Electronics Forum | Wed Mar 07 13:58:06 EST 2018 | griinder
We are using Gerber EZ Teach to inspect near 100% of some boards. Many component footprints seem to be assigned custom packages. These custom packages come up as "preview errors" during inspection. I have noticed when I manually move the camera to th
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Mon Jun 29 13:44:45 EDT 1998 | Russ Miculich
The mini-BGA was to be smaller than the standard BGA and larger than the micro-BGA. The last I heard there will be no mini BGA but companies such as Tessera, AMKOR-ANAM, etc. will go directly to supply 0.020" center to center pitch micro-BGA's. You
Electronics Forum | Fri Oct 22 19:52:47 EDT 1999 | Garth Monlux
I need to know the recommended pad layout for a 44r package. The part is an atmel flash AT49F004. Is there a standard that I can look at?
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
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